Used AMKOR 6 CHASE 168 CAV #9109071 for sale

AMKOR 6 CAE 168 CAV is a high-establishing interconnect packaging solution designed to address the emerging need for a more cost-effective product mix for the development of today's complex equipment-level products. The system is durable, reliable, and highly integrated, allowing for faster time-to-market and a higher return on investment. The unit is based on a core element, AMKOR Steel Wire Bonding (SWB) technology. SWB is a unique process that bonds a conductive bonding wire to the contact pads on a semiconductor die, forming an electrical interconnect between the two components. Additionally, multiple lands are formed on the die pad to secure the die to the IC package. Maximum pad density is achieved with minuscule cavity heights due to the loss of air gaps between the bonding pad and the die. The machine also features a Mold Compound (MC) carrier. The MC provides an effective means of mechanical protection and thermal management for the delicate components within the package, and also allows for optimal package routing and management. With the MC in place, electrical connections between the components can be made more robust, since it acts as a heat sink for the entire package. The tool also features AMKOR proprietary die attach process. This process eliminates surface-mount copper filler and allows direct die bonding to the top surface of the MC without the need for additional mounting lids, clips, or other components. With this advancement, pins and traces are minimized, maximizing tester uptime and cutting product cost. Finally, the asset features AMKOR superior positional accuracy and higher attach yield rate. This advanced placement accuracy includes fine-pitch attribute, high transfer accuracy, and low-cost manufacturing specifications. It also offers a wide range of signal routing options, enabling designers to easily implement board-level features such as power and ground bounce protection, grounding of the die to the IC substrate, and trace routing capabilities. In conclusion, 6 CAE 168 CAV is a cost-effective interconnect packaging solution, ideal for developing complex model-level products. The equipment leverages a variety of technologies, such as cavity heights, steel wire bonding and mold compound carrier, die attach, and positional accuracy processes, allowing designers and manufacturers to realize improved electrical performance, improved reliability, faster time-to-market, and reduced overall product cost.