Used AMKOR 6 CHASE 168 CAV #9109078 for sale

AMKOR 6 CAE 168 CAV is an advanced packaging technology designed for high density and complex equipment-in-package (SiP) applications. It is an efficient and cost-effective method for integrating multiple cores and chips in a variety of formats, including CSPs, wire bonded, BGA, and direct-butted components. The system features six-level, high density cavities with a minimum silicone-filled pitch of 2.5 mm and is compatible with multiple package sizes, ranging from 58mm x 32mm to 100mm x 100mm. 6 CAE 168 CAV provides increased integration of higher performance, dense device packaging in a compact form factor. It combines electro-magnetic interference (EMI) shielding, high-frequency routing, heat dissipation, and co-planarity into a single package that wraps the entire device and provides additional protection against electrical noise and vibration. The unit has a 1.7mm to 3.5mm step height range and a hemi-planar base to enable high-performance die-attach and wire-bonding processes. AMKOR 6 CAE 168 CAV machine utilizes a spread-fan-out pattern to ensure consistent adhesion while reducing via resistance. It is constructed with robust high-performance materials that are designed to withstand mechanical shock, temperature variation, and other environmental conditions. The tool supports the integration of high-density, highly-integrated devices, with features such as built-in thermal management, power regulation, and EMI shielding, as well as multiple decoupling capacitors and surface mount components. Additionally, 6 CAE 168 CAV asset includes integrated test/probe points for direct electrical and/or mechanical connections. The model employs multiple module-level integrated test and electrical performance optimization techniques to ensure maximum reliability, and comes with an extensive design library that allows for the use of advanced impedance controlled signal trace routing and layer transitions. Overall, AMKOR 6 CAE 168 CAV offers an efficient, reliable, and cost-effective solution for densely integrated, complex SiP applications. Its high-density cavities and adjustable step height range make it an ideal choice for creating intricate packages while delivering exceptional performance. Additionally, the equipment's built-in features, including EMI shielding, thermal management, power regulation, and multiple decoupling capacitors, make it a reliable solution for demanding environments.