Used AMKOR 6 CHASE 264 CAV #9109080 for sale

AMKOR 6 CAE 264 CAV is a type of modern packaging equipment suitable for a variety of applications. It is a 6 lane (CAV) type with a 264 mm exterior width. It is designed and manufactured by AMKOR Technology Inc., a company that specializes in designing, engineering, and fabrication of printed circuit board interconnect solutions. The primary purpose of the system is to provide efficient, reliable package solutions that are compatible with a number of different integrated circuit (IC) form factors. This unit offers economically priced solutions for high-density circuit. It has a higher aspect ratio and a reduced footprint which helps in reducing costs. 6 CAE 264 CAV setup includes multiple PCB and die management mechanisms such as die attach, wirebond, substrate build up, and connector insertions as well as several testing procedures. It includes six cavities, each with two cavities stacked in parallel. Each cavity contains two adjustable guide blocks, which provide precise alignment to the substrate under test and helps minimize material and process waste. The machine also includes a stripper tool that allows for easy removal of the labels and protective foils used on the packages. This simplifies the setup and enables quick work cycles. The asset is equipped with a high-speed wirebonding model that allows for efficient heatmelding of die and bond wires. The emitter equipment is capable of handling multiple feeders, multiple heads or a single head configuration. The system also includes an adjustable vision unit that allows for accurate ingredient placement and measurements. It is designed to accurately direct the beams for precise alignment. In addition, the machine is setup with several safety features. These include a feedback tool that monitors the asset for any deviations from the operational standards or any potential malfunctions. It has sensors to detect any abnormalities and safety locks that act as fail-safe systems. AMKOR 6 CAE 264 CAV provides cost-effective package solutions for a variety of circuit form factors. Its safety features and reliable ceramic die attach and flexible vision systems enable it to be suited for a variety of packaging requirements.