Used ASAHI BGA-6 #9380938 for sale

ASAHI BGA-6 is a packaging equipment designed by ASAHI Silicon specifically for the purpose of accommodating highly integrated semiconductor devices. The system utilizes a high-density board-to-board package solution and offers a wide range of standard and customized sizes to accommodate changing package densities. BGA-6 utilizes flip chip technology, allowing the devices to be soldered onto the board in a variety of orientations. This eliminates the need for expensive, complicated and custom fabrication of the board. The unit features a standard pitch of 1.0 mm and a maximum pitch of 2.0 mm, allowing components up to 2.0 mm in height to be secured. Its high-temperature capability allows for the placement of ASAHI BGA-6 in an application where high operating temperatures are likely to occur. The seated BGA-6 devices are designed to be robust enough to handle extreme shock and vibration environments, and can be screened and tested prior to post-solder rework. In addition, the efficient design allows for improved thermal management of components as well as a high degree of electrical shielding against signal degradation, crosstalk, and interference. The machine is optimized for high-speed signal intra-layer routing, which reduces signal losses and provides a higher- performance solution where high speed signals are required. For increased protection against harsh environments, ASAHI BGA-6 package is coated with an infrared (IR) reflecting material that is highly resistant to shorting, temperature changes, and contamination. This coating is also highly water resistant, making it a very reliable choice for outdoor or otherwise exposed applications. BGA-6 tool is ideal for highly integrated systems with high density components, offering a smaller overall footprint and improved thermal management. Its high-speed signal routing capabilities, robust environmental protection, and robustness make it an ideal solution for designers looking for a reliable, efficient, and cost-effective packaging solution.