Used ASAHI Cosmo BGA-6 #9212404 for sale

ASAHI Cosmo BGA-6 is a high-performance ball grid array package (BGA) equipment designed for demanding industrial applications. The system features a low-profile package combined with a heat sink enabling superior thermal performance. The package also utilizes advanced soldering technologies which provide robust connections to boards and other components even in high-temperature environments. The BGA-6 package includes a number of pins, thermally bi-sector mounted with a solderable surface for connection to boards. The solderable surfaces are oz-resistant and highly reflective, resulting in excellent electrical and mechanical connections and enhanced thermal transfer. Additionally, with the help of an optional additional heat sink, the BGA-6 package can provide increased surface-heat radiating area and reduce thermal resistance of the package. The BGA-6 package also features a hard-back die attach process and a multi-layer ceramic insulating unit for increased reliability. The hard-back die attach process ensures that the BGA package is securely soldered to the board and guarantees excellent electrical and thermal performance. The multi-layer ceramic insulating machine increases the package's waterproofing and shock-proofing capabilities, making it ideal for demanding industrial applications. The BGA-6 package has a variety of mounting options, including support for through-hole and surface mount board-level mounting, as well as a low-profile design for surface mounting of components. Additionally, the BGA-6 can be manufactured with an optional lead frame or preforms, further increasing its versatility and performance. Cosmo BGA-6 tool offers a durable, high-performance packaging solution for industrial applications that demand superior thermal performance, reliability, electrical and mechanical connections. It is a versatile solution that offers a variety of mounting options and increased waterproofing and shock-proofing capabilities. The BGA-6 package is perfect for a variety of challenging industrial applications, including automotive, aerospace, and industrial automation.