Used ASAHI Cosmo BGA-6 #9239923 for sale

ASAHI Cosmo BGA-6 is an advanced packaging system for microelectronics components. It uses a Surface Mount Technology (SMT) process integrated with a Ball Grid Array (BGA) structure. The BGA-6 is designed for hi-reliability applications and its innovative design includes several features that make it suitable for low-volume and high-volume manufacturing. The BGA-6 allows for a maximum number of pins and connections, using a specialized branch circuit. This allows for intense pin size reduction, resulting in improved device performance and reliability. It is also compatible with a wide range of circuits, from high-end applications to consumer boards. The BGA-6 has a peak operating temperature of up to 300°C, which facilitates soldering and re-work applications. BGA-6 has a unique design that allows for easy placement of components on the substrate. Its small package size and reduced footprint make the BGA-6 suitable for compact designs. Additionally, its high power dissipation properties enable the production of higher power components that require less cooling. The BGA-6 complies with a variety of industry standards, such as IPC-2221A, and RoHS. In addition, it features a high thermal resistance, which prevents the over-heating of soldered connections. This prevents damage to components and ensures reliability. Cosmo BGA-6 is a cost-effective and reliable packaging system for microelectronics components. Its features and design enable high-reliability, low-volume and high-volume manufacturing require. Additionally, its small size and high power dissipation make it suitable for compact designs. The BGA-6 also features a variety of industry standards, such as RoHS and IPC-2221A, which ensures safety and reliability.