Used ASAHI Cosmo BGA-6 #9263250 for sale

ASAHI Cosmo BGA-6 is a modular ball grid array (BGA) semiconductor packaging system designed for improved thermal and electrical performance. The package consists of a lead-frame with a central die pad, which typically holds multiple die and wire bonds, and a BGA array with solder balls that facilitates the mounting and connection of multiple ICs (integrated circuits) to the substrate. The package is designed for high-performance computing, automation and motor control applications, such as smart TVs, digital cameras, gaming consoles and robotics systems. Cosmo BGA-6 is an innovative, ultra-compact solution that provides superior heat dissipation and power signal integrity. The package includes a high-efficiency dielectric layer, which prevents dielectric losses that can lead to signal degradation and crosstalk. Additionally, the flexible design allows for efficient and effortless reprogramming and re-engineering for future needs. The package features a grid array of 0.5mm pitch, allowing for a compact footprint while ensuring a high degree of mechanical robustness. The package includes a ceramic and plastic mold compound, which not only provides enhanced shock and vibration protection, but also maximizes thermal efficiency. The package is designed for reliability, and has been tested to withstand environmental stress testing, such as shock, vibration, thermal cycling, and moisture absorption. The device also includes an advanced package construction that reduces bonding and assembly force, as well as improves long-term reliability. The shape and pitch of the grid array also contribute to increased mechanical robustness and repeatability during reflow soldering. ASAHI Cosmo BGA-6 is designed to be compatible with a variety of lithography and assembly processes, allowing for flexibility across different production platforms. The package is also compatible with a variety of advanced integrated circuit fabrication techniques, which can improve its overall performance. In addition, the CMO BGA-6 is RoHS compliant, making it an eco-friendly packaging choice. In conclusion, Cosmo BGA-6 is a modular, ultra-compact semiconductor packaging solution that is designed to deliver improved heat dissipation and electrical performance. Its flexible and repeatable grid array design provides a robust and reliable package, making it a popular choice for designers of high-performance and power-demanding projects.