Used ASAHI Cosmo BGA8-40 #9080858 for sale

ASAHI Cosmo BGA8-40 is a revolutionary packaging equipment for surface mount integrated circuits (ICs). It is specifically designed for high-density applications where space is at a premium. The packaging system is a combination of a Ball Grid Array (BGA) 8-40 package and ASAHI Cosmo Holder. The BGA 8-40 package is a compact way to package larger ICs, such as CPUs, GPUs, and cellular communications chips. This type of package is also referred to as an "L-shape"BGA. The package is 8mm x 40mm in size, with 28 solder balls arranged in a pattern that allows for greater penetration of heat during the assembly process. ASAHI Cosmo Holder is a tool-less and double-ridged board specifically designed to hold the BGA 8-40 package. The holder is made of flame-resistant glass fiber reinforced plastic with a non-slip surface, and is designed to prevent contact between the bottom of the BGA package and the board. This feature is especially important in high-density applications where thermal conductivity is essential. The holder also features special integrated signal and power contacts that provide secure electrical connection between the holder and the BGA package. This prevents assembly errors caused by unintentional contact between the holder and the bottom of the package. Cosmo BGA8-40 package and ASAHI Cosmo Holder are ideal for applications that require a combination of high-density and high-performance. The unique shape of the package and the double-ridged holder offers improved heat dissipation and signal integrity and helps to reduce the complexity and cost of board design. In addition, the tool-less nature of the holder makes assembly and rework easier and faster. This makes ASAHI Cosmo BGA8-40 packaging unit an ideal solution for designers and manufacturers who are looking for a sophisticated and reliable packaging machine for their high-performance and high-density applications.