Used BONDZTEK Wafer mount #9396922 for sale

BONDZTEK Wafer mount is a packaging system used to securely mount semiconductor die onto a printed circuit board (PCB). The package consists of an advanced bonding substrate, which includes an array of aluminum oxide ceramic chips and an integrated interposer. The ceramic chips are connected to the PCB via a compression molding process, allowing electrical connections to be made between a die and the PCB. The ceramic chips provide an efficient way to package multiple die onto the same PCB utilizing low-cost, low-volume processes. The ceramic chips are connected by an integrated interposer structure, which provides a reliable electrical connection between the chip and PCB. The interposer also helps to minimize thermal and electromechanical performance variance between die and PCB. The die packaging of Wafer mount is completed with a special encapsulant material that bonds the die to the surrounding ceramic chip. The encapsulant not only makes the chip and die adhere to each other, but also serves as an environmental barrier protecting the die from moisture, dust, and other contaminants. The encapsulant is rigorously tested and verified by electrical testing before being qualified for production. The ceramic chips are designed to be used in large-scale wafer level processes, as well as for Volume production applications. BONDZTEK Wafer mount's advanced electroplating and solder pasting processes enables the package to deliver a high-speed data transfer between devices and minimize power consumption. Additionally, the ceramic chips enable the package to easily conform to irregular board shapes without sacrificing performance. Wafer mount is used for applications requiring high performance, high-frequency, and multiple die packages. The package's advanced bonding substrate and integrated interposer makes it an excellent choice for those applications. The package's lead-free assembly and environmental protection capabilities make it ideal for a variety of applications in consumer electronics, automotive, medical, and industrial industries. The package is also compatible with both traditional and advanced manufacturing processes. Overall, BONDZTEK Wafer mount provides an efficient, cost-effective packaging solution for multiple die applications that require high-frequency performance and a low-maximum package height. This makes it suitable for a variety of applications in the consumer, automotive, medical, and industrial markets.