Used FICO / BESI Compact Line #9253300 for sale

FICO / BESI Compact Line is a state-of-the-art packaging equipment designed for semiconductor components. It is a multi purpose system capable of packaging boards, RFMs (radio frequency modules), and BRMs (building radio modules). This unit enables ultra-high performance in a minimal footprint and is capable of handling materials up to 5mm in thickness. FICO Compact Line is a fully automated machine that has all features necessary for packaging components such as pick and place, taping, bonding, profiling, and laser marking. The pick and place head of BESI Compact Line employs high speed vision-based placement with built in edge detection. This feature ensures precise placement of each die and eliminates the possibility of misplacement. The machine also offers advanced identification features and various positioning capabilities. It is also capable of handling a wide variety of package sizes and shapes. A specially designed central working chamber enables the precise placement of larger dies in the center of the package for optimal performance. The taping capability of Compact Line offers an efficient and reliable package sealing process. This ensures that all components are sealed securely for safe transportation and distribution. The bonding feature offers a secure connection between packages for long lasting applications. The profiling function offers multiple profiles that can be chosen which suit the component being packaged. The laser marking capability allows quick and clear identification of the die on the package for fast recognition. Overall, FICO / BESI Compact Line provides a fully automated, high performance packaging tool for semiconductor components. Its robust design and advanced features enable it to handle a wide range of package sizes and shapes while maintaining precision and accuracy. With its highly reliable taping, bonding, profiling, and laser marking capabilities, FICO Compact Line provides an efficient solution for a variety of packaging applications.