Used FICO / BESI TFM-A #9165773 for sale

FICO / BESI TFM-A device is a production packaging equipment for high-speed blister and slide blister packaging, top-loading pocket packaging, and tipping and de-tipping par-packaging applications. It is specifically designed to provide cost-effective and efficient package production and efficient material handling for medium to high duty applications. The high-speed,precision motion and thermal management systems employed in FICO TFM-A enable the providing of a reliable and high-performance production flow with minimal maintenance and maximum uptime, even in demanding conditions. The system can handle a wide range of materials and formats, allowing for flexibility and scalability and enabling operators to quickly adapt to new material formats or production changes. BESI TFM-A's modular design is based on the "one platform, one machine" concept, which simplifies integration, installation and expansion. It also allows for easy access to components for maintenance needs, ensuring optimal operations and minimizing downtime. The unit features an advanced automation machine based on a Cognex industrial vision tool, which results in a more efficient material flow and reduces human intervention. The asset is designed with user-friendly interfaces and touchscreen controls. This simplifies parameter setup and allows for enhanced machine monitoring. In addition, the model is equipped with real-time/automatic fault detection systems that allow for quick and easy fault diagnosis as well as fast production recovery. Weighing and weight control systems are also present to help ensure the accuracy and consistency of the package production. Finally, TFM-A features high-speed sealing and forming using the Ultrasonic Horn and Heat Rod technologies, which ensures fast and efficient sealing and forming of products. It also provides enhanced technology, such as online product changeover, automatic material loading and unloading, and automatic re-feeder systems to ensure a smooth production flow. This combination of technologies allows for a stable, high-performance packaging equipment with minimal downtime and low maintenance costs.