Used FICO / BESI TFM UF #293634769 for sale

FICO / BESI TFM UF is a full-body 3D packaging equipment for functional and transport support of advanced electronic packaging solutions. This system is designed for the production of high-reliability, high-density electronic products including microprocessors, memory chips, circuit boards, and other components. FICO TFM UF packaging unit utilizes a three-dimensional (3D) framework to integrate high-performance components, thereby providing maximum support and protection to those components. The framework contains two main parts: a thermoforming element and a Functionalizer element. This combination of technologies allows for the production of high-density, low-cost electronic packaging solutions. The thermoforming element uses a heat-resistant thermoplastic film as the substrate material, which is then heated and molded into the desired shape. This process allows for the production of intricately shaped parts, such as microprocessors or memory chips, with a high degree of accuracy. As the substrate is heated, it is manipulated into the desired shape and held in place for support and protection. The Functionalizer element is made up of layers of functional material, which is applied to the substrate to provide an array of functional capabilities. The functional material used can be customized to meet the performance needs of the product. This layer of material serves to provide electrical connections, mechanical support, and other functionality, such as signal and heat conductivity. In addition, BESI TFM UF packaging machine is designed to be compatible with most production processes, including injection-molding, extrusion-molding, and die-cutting. This flexibility allows for the production of a wide range of packages and components, including board-level, chip-level, and package-level components. Overall, TFM UF packaging tool is designed to provide a full-body, reliable and cost-effective solution for the production of high-density and high-performance electronic components. By integrating both thermoforming and Functionalizer technologies, this asset is able to provide optimized support, protection, and functionality to the components within. This makes it an ideal model for the mass production of advanced electronic components.