Used FICO / BESI TFM UF #9360915 for sale

FICO / BESI TFM UF (Ultra Fine) is a comprehensive packaging equipment that offers consistent and repeatable formation of semiconductor packages. The system provides flexibility for both fine pitch wire bonding and gullwing lead frame styles. The unit enables high volume production for a variety of package types, from small chip scale packages (CSPs) to an array of flip-chip designs. It is optimized for use in fine pitch automotive applications, such as MEMS and sensors, by providing flat, high-aspect-ratio designs within the space-constrained environments. FICO TFM UF uses deposition, dielectric etching, and through-hole metallization technologies to create a robust, ultra-fine package outline. It utilizes optimized deposition techniques to improve package reliability and performance. The technique results in a package that is: 1. Ultra-fine, for high density applications; 2. Highly repeatable and durable; 3. Capable of supporting fine-pitch wire bonding and can accommodate up to 12 mm dielectric etching area. BESI TFM UF further simplifies the design process by providing flexibility and modularity. The optional multi-spindle transfer tool can be used to transfer multiple packages simultaneously to reduce cycle time. In addition, the packaging assembly process is automated, requiring minimal operator intervention. The machine also supports advanced manufacturing technologies, including deep UV lithography, sputter deposition, etching, and plating. These capabilities enable the processing of challenging component designs and cutting-edge material structures. Overall, TFM UF is an ideal solution for high-volume and fine pitch automotive packaging needs. It provides optimized formation of both wire-bonding and flip-chip packages. Its automated assembly process and advanced manufacturing technologies give it the ability to handle highly challenging designs. This reliability and performance make it an ideal solution for automotive applications, as well as those involving MEMS or other precision packaging needs.