Used FICO / BESI TFM UF #9360916 for sale

FICO / BESI TFM UF is a thermallane forming module (TFM) equipment designed to form custom and specialty packages. It uses Dual-feed Extrusion System (DES) technology to quickly and accurately form custom packages that increase efficiency and speed. The TFM is designed for use with Ultra-Thin-chip (UT) packaging technologies, making it ideal for applications requiring extremely small components. The TFM unit provides an integrated thermal forming solution that utilizes automated pick and place equipment and a two-part forming station. The pick and place equipment transfers the UT component from the tray to the opening of the two-part forming station. The two-part foaming station compresses the UT components and forms it uniformly by applying pressure from both sides. This allows the user to create packages that are both precise and efficient. FICO TFM UF also features high-performance hot blister sealing capability that ensures precision and repeatability during production. The machine is equipped with a robotic arm that holds a head that is capable of quickly and effectively sealing the UT components to the package. Its proprietary sealing technology ensures a tight, uniform seal and provides a consistent and reliable performance. Its advanced, automated design reduces manual labor and increases production capacity. BESI TFM UF is an advanced, efficient, and cost-effective solution for forming small components. Its efficient hot sealing capability, automated design, and dual-feed extrusion machine make it a great choice for high-volume applications. By providing an integrated solution that is reliable and efficient, TFM UF is an ideal solution for businesses looking to increase production capacity and improve process times.