Used FUJITSU QFP14X20 #293647434 for sale

FUJITSU QFP14X20 is a packaging system designed for integrated circuits used in electronic devices like computers, phones and other portable devices. It is a leaded chip carrier (LCC) package with gull-wing leads at the periphery and it's an ideal package for chip-on-board (COB). It is an extremely compact and reliable package with 14x20mm footprint and low profile of 0.8mm height. QFP14X20 is composed of a plastic material molded and etched leadframe with bronze alloy leads. It is suitable for a wide range of application such as power amplifiers, power controllers, medical devices, and instrumentation. The package features lead counts up to the 208 and a wide range of operating temperatures. It consists of an internal lead pitch of 0.5mm and a 0.5mm body pitch. Its low profile design allows for space sensitive applications, target mounting and improved air flow. It is designed for an environmental friendly production process with a lead-free and halogen free package for reflow soldering process. FUJITSU QFP14X20 meets high electrical performance in terms of current and voltage carrying capacity, providing a high quality, reliable and consistent performance. With its lead-free plating, it provides reliable solderability, thermal and mechanical shock resistance, vibrations resistance and drop shock resistance. The single lead pitch allows for increased power efficiency, low power loss and improved component alignment. With its extremely thin, flat and reliable contacts, it enables a more cost-effective and space saving design. QFP14X20 package is designed to meet the tightest design requirements and minimizes the total cost of product development and manufacturing. It features halogen-free, lead-free and mercury-free plating which makes it both eco-friendly and user-friendly. It's compliant with RoHS and WEEE to ensure safe and clean device operation. It also comes with an electrostatic discharge protection for enhanced protection against static. Overall, FUJITSU QFP14X20 package is a compact, reliable and cost-effective packaging solution for a variety of electronic items and devices. It is a leaded chip carrier (LCC) package which provides a space saving and low profile package that meets the tightest design requirements. It is compliant with RoHS and WEEE, lead-free and halogen-free. It provides users with very low power losses and improved component alignment.