Used FUJITSU QFP14X20 #293647438 for sale

FUJITSU QFP14X20 is a Quad Flat Pack (QFP) packaging equipment developed and manufactured by the Japanese electronics firm FUJITSU. This type of packaging system is used to support very large components on the surface of a printed circuit board (PCB). QFPs are also known as Low-profile Quad Flat Pack components, as they feature low-profile pins that allow PCBs to be made denser and thinner. QFP14X20 is a type of QFP packaging unit that uses a 14x20 grid of lead pins. This grid is formed around the component, with the pins extending downwards so they can make physical contact with the solder points on the surface of the PCB. This ensures secure, reliable connections between the component and the board. FUJITSU QFP14X20 utilizes a lead-free solder as its connection material, which helps to improve the component's reliability and electrical performance. In addition, QFP14X20's proprietary heat-resistant substrate ensures improved thermal efficiency and protection against heat damage. FUJITSU QFP14X20 is highly compatible with other QFP packaging systems as well. As a result, it can be used in a variety of hybrid systems that may contain other types of QFP components. This makes it an ideal choice for applications that require efficient power consumption. QFP14X20 boasts several advantages over other QFP packaging systems. Its size and weight are a fraction of that of the conventional QFP systems, and it offers improved resistance to external stress. Its pin configuration is much simpler than that of other QFP systems, and therefore requires fewer man-hours for PCB assembly and inspection. Furthermore, this type of QFP packaging machine features a wider operating temperature range and improved power consumption. Finally, FUJITSU QFP14X20 is more cost-effective than conventional QFP systems. As a result, it is suitable for a range of applications, including consumer electronics, computing, automotive, and industrial use. This fantastic packaging tool is a reliable way to support very large components on the surface of a PCB.