Used FUJITSU VLSI #9379201 for sale

FUJITSU VLSI
Manufacturer
FUJITSU
Model
VLSI
ID: 9379201
Wafer mounter.
FUJITSU VLSI is a packaging technology used for integrated circuit (IC) designs. It was designed to facilitate connections between ICs and other types of components in a modular approach by providing a framework and guidelines in order to assist in miniaturization, reliability, and testing. It is suitable for a variety of materials, such as silicone, epoxy, and polymer, and for a broad range of IC types, including mixed-signal, analog, digital, RF, and microwave. VLSI provides various solutions for IC integration and packaging. For digital ICs and systems, high-density packages are available in a variety of sizes and configurations. These packages are designed to reduce the area they occupy, thereby achieving miniaturization. In addition, these packages can also improve the performance of digital ICs by increasing speed and power. For mixed-signal ICs, packages are available with modular assemblies for analog and digital components, allowing for efficient connections and space savings. It is also possible to incorporate modules with higher integration densities, such as hybrids and multi-chip modules, for various system-level integration requirements. In addition to its modular design, FUJITSU VLSI also features several technologies for improving performance, reliability, and testing. For instance, to reduce signal noise, packages with high-speed traces are available. To lower power consumption, low-power consumption packages are available. For improved reliability, packages with no mechanical contact, such as flip chip, are available. For testing purposes, packages with increased test points are available. By using VLSI, ICs may be packaged within a much smaller size compared to conventional packaging solutions. This is due to the use of high-density packages, which include dual-in-line packages, ball-grid arrays or flip chip technology. As a result, FUJITSU VLSI devices have high packing densities, allowing for miniaturization and higher levels of system integration. In conclusion, VLSI is a modular packaging technology which provides several solutions for high-density IC integration and packaging. It is suitable for a variety of IC types and materials, and offers several technologies for improved performance, reliability and testing. By implementing FUJITSU VLSI, ICs may be packaged at much smaller sizes compared to conventional solutions, allowing for miniaturization and higher levels of system integration.
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