Used MICRO MODULAR SYSTEMS AFL-C2-SVMS-A.ATT #9197412 for sale

MICRO MODULAR SYSTEMS AFL-C2-SVMS-A.ATT is a packaging equipment used in the semiconductor industry. It is a multi-chip, dual-gated, floating lead, system-in-package solution that provides a cost-efficient and space-saving solution compared to traditional leaded chip packaging. The unit is based on a stacked-die structure, using a package substrate, interposer layer and cover layer to create a full 3-dimensional package. The package substrate is a laminate material that incorporates both conductive and dielectric layers. The interposer layer contains two parts - a solderable leadframe that connects the various components and a support framework that holds the components together. The cover layer is a plastic that serves to protect the components and create a finished package. The package machine is designed to operate at temperatures up to 250°C in order to meet the requirements of high-power applications. The tool is also capable of withstanding mechanical shock and vibration, allowing it to be used in shock sensitive applications. It has a small package size with short lead lengths, enabling it to be used in area-constrained devices. The asset includes a set of interexchangeable components, which are compatible with conventional die attachment processes. These components can be used to provide a variety of logic gate functions, allowing the model to be used for complex applications. The package also includes a variety of optional features to optimize the performance for specific applications. MICRO MODULAR SYSTEMS AFL-C2-SVMS-A.ATT package is designed to provide a reliable and cost-effective solution for semiconductor assembly. Its small package size, wide range of compatible components, and robust mechanical performance make it an ideal solution for applications that require both performance and reliability.