Used NITTO DENKO USD-6·D-8·3-7 #293587897 for sale

NITTO DENKO USD-6·D-8·3-7
ID: 293587897
Wafer Size: 6"
Vintage: 1989
System, 6" 1989 vintage.
NITTO DENKO USD-6 D-8・3-7 is a type of packaging equipment developed by NITTO DENKO, a global manufacturer and system integrator of innovative materials and components. This unit is a combination of 3 key components: USD-6, D-8, and 3-7. USD-6, or Unit Starch Dispersion 6, is a non-thermoplastic starch-based adhesive used to bind paper and recycled fibers in the creation of paper-based packaging materials. Its high-performance adhesive machine creates strong bonds, allowing it to be used in a variety of packaging applications. D-8, or Disponsive pack, is a tool of polypropylene or polyethylene film that provides protection for packaging materials. It helps protect the packaged material against dust, moisture, heat, and impact damage. The polypropylene or polyethylene film is also used to hold dust particles in place. 3-7, or Cardboard Attachment, is a cardboard-based bonding asset. It allows users to securely attach cardboard to paper-based packaging materials. Its high-strength bond enables it to be used in a variety of applications, including the creation of custom cardboard packaging. When combined, the three components of NITTO DENKO USD-6 D-8・3-7 model create a packaging equipment that not only offers superior protection for packaging materials but also provides a robust, cost-effective solution. This system is capable of protecting materials from dust, moisture, heat, and impact damage. Furthermore, it offers a secure bond, preventing the separation of paper from the cardboard and other substrates. The unit is also easy to install, making it a great option for a variety of packaging solutions. By utilizing NITTO DENKO USD-6 D-8・3-7 packaging machine, companies are able to create a secure, cost-effective packaging solution that meets their needs and helps protect the materials within. This tool offers a secure bond between components as well as superior protection against environmental factors, making it a great option for a variety of packaging solutions.
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