Used SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY 2835 #9358783 for sale

SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY 2835 packaging equipment is designed to be used for semiconductor packages and assemblies, allowing Integration of various components into a compact package. This system offers high-level flexibility, allowing a wide range of die sizes, lead counts, and other package parameters. It also offers a high-level of reliability since all mapping layers are equipped with hermetic feeds, angular contact pins, and an automated test unit. The SHENZHEN BIAOPU2835 packaging machine has a lead-in mechanism which contains an automated probe card, which is used to check connections between different components within the package and to check performance parameters. It also has the ability to measure die size and contact positions so that optimum packaging can be achieved. The automatic probe cards are capable of measuring a variety of parameters through the use of light-induced current pulses and vibration-induced contact detection. The tool also has the capability to capture signal integrity data during the process of putting together the package. The SHENZHEN BIAOPUSHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY 2835 packaging asset also utilizes a wide array of technologies to ensure reliable and reliable package design and integrity. Its die attaching mechanism is designed to provide reliability with a die-attach rate of up to 98%. This is made possible through Alloy micro-sphere and precision brush applicators. The die attach model is also capable of supporting multiple die types without reconfiguration and can accommodate flip-chip packaging applications. The equipment also has a mold-lock feature which uses a mechanical hinge and spring lock to ensure reliable connection of the package. The mold-lock features allows for environmentally sealed packages and ensures robustness even in harsh environmental conditions. Furthermore, the system also has an automated package test unit which uses electrical tests and scanning electron microscopy to check for defects and ensure optimal performance. In conclusion, the SHENZHEN BIAOPU2835 packaging machine is a highly advanced and reliable solution for semiconductor packages and assemblies. It offers a combination of unique design features, technologically advanced die attaching mechanisms, and a wide range of tests to ensure optimal performance and reliability. Its automated test systems provide a comprehensive set of tests for ensuring package integrity and reliability.