Used SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-02-2835 #9303241 for sale

SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-02-2835 is a state-of-the-art IC (Integrated Circuit) packaging equipment. It is a multi-chip module, enabling the simultaneous integration of multiple ICs in one seamless package. The system utilizes a semiconductor chip and, in some cases, passive components. BP-02-2835 unit offers significant advantages in terms of size, reduced cost and improved thermal performance over traditional die-level packaging techniques. It includes a cost-effecting pin-grid array (PGA) substrate with built-in features such as thermal via-in-pad (TVIP) and multilayered microstrip paths for a range of analog, digital and mixed signal designs. SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-02-2835 offers advanced printing technology with a minimum line width of 0.1mm and a slicing thickness of 0.25mm. This printing technique enables the production of flexible packages which can accommodate a variety of IC types. In addition, BP-02-2835 machine provides enhanced thermal performance with its unique through-vias-in-pad (TVIP), allowing the transfer of heat generated by the ICs and dissipating it through the substrate. The tool also has built-in features such as gold plating on the external pads of the chip to enable greater networking capability and ensure a reliable electrical connection. SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-02-2835 enables the use of solder mask to protect the connection and prevent oxidation. BP-02-2835 is suitable for highly complex applications such as aerospace and medical applications,.due to its reliability and advanced wiring capabilities. PCIe is also supported with the addition of a mezzanine solution. In conclusion, SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-02-2835 is an advanced packaging solution. It features a cost-effective PGA substrate, unique thermal via, gold plating, and solder mask for superior performance and better protection. It is suitable for a range of applications where power and size are critical factors, and supports multiple integrated ICs in one package.