Used SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-2-2835 #9303243 for sale

SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-2-2835 is an advanced packaging system for packaging semiconductor chips. The package is designed to contain a single die and includes eight pins, two of which have an embedded resistor. It is a 2mm x 2mm dual-ball PGA package that allows easy insertion of die and eliminates the need for manual pin insertion. The package is suitable for high-density and low-profile applications. BP-2-2835 uses a plastic mold press technology for the package construction. The plated copper lead frame has a solder ball in the center and is encapsulated in a thermoplastic material. After the encapsulation process, the die is attached using an electrostatic bonding process. The package is designed to have low profile and high resistance to moisture and stress. It is compliant with the JEDEC standard and is RoHS compliant. SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-2-2835 has a maximum operating temperature of 105° C and a storage temperature range of -65° C to +150° C. The mean time to failure is greater than 10,000 hours at 25° C. The package also features excellent electrical performance and is designed for a wide range of applications, including cellular, Bluetooth, wireless phones, and digital cameras. The package also has a high T j max rating, which makes it suitable for use in high-temperature applications. BP-2-2835 is designed to be compatible with a wide range of interposers and board materials. It has a component placement accuracy of ±0.01mm that reduces the number of misalignment soldering occurs. The package's low resistance and thermal resistance also reduce power consumption for more efficient design. SHENZHEN BIAOPU SEMICONDUCTOR TECHNOLOGY BP-2-2835 package is highly recommended for applications in the wireless, Bluetooth, and cellular industries. It meets the needs of high-density applications while also providing excellent thermal and electrical performance. The package is designed for ease of use and is RoHS compliant for compliance with environmental regulations. Combined with its small size and low-profile design, BP-2-2835 is an optimal choice for packaging semiconductor chips.