Used SUN-SMD A13-200 #9205183 for sale
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SUN-SMD A13-200 is a type of Integrated Circuits (IC) packaging equipment produced by SUN-SMD, Inc., a leading global electronic components provider, and is particularly suitable for automated assembly lines. The system is an advanced version of the A13-100 and features an optimized, low-cost design that is more efficient than traditional manual methods. It uses an advanced Pick-and-Place approach to quickly assemble ICs onto a printed circuit board (PCB). The unit provides a reliable solution for IC assembly needs and is designed for use in a variety of components, including MEMS and other non-electronic products. The machine has proven to be a cost-effective option for medium- to high-volume production runs, and is capable of fulfilling both standard and specialty requirements. A13-200 package consists of several modular parts, including a Pick-and-Place Head, a vacuum feeder, a semi-automated controller, and software. The head is designed to be simple and fast, using an onboard vision tool to accurately align components on the PCB during assembly. The vacuum feeder allows multiple components to be held simultaneously, while the controller supervises the assembly process, sensing and correcting irregularities, and providing feedback throughout the process. The software includes a library of components and a database containing a list of all parts currently being assembled. This database also stores information such as assembly times, components used, and production quality. The database facilitates user programming to ensure accuracy and repeatability during assembly. SUN-SMD A13-200 is a highly reliable and efficient asset, suitable for medium- to high-volume production runs. It combines sophisticated software capabilities with an advanced Pick-and-Place technology. This model allows users to assemble ICs quickly and accurately on a PCB, surpassing the limitations of traditional manual methods. The highly integrated design is also cost-effective, allowing users to save money on assembly costs and reduce time-to-market speeds.
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