Used TSP TO-92-III #9150622 for sale

TSP TO-92-III is a packaging system used to protect semiconductor devices from environmental damage and tampering. It is often used in consumer electronic applications, including mobile devices. TO-92-III package consists of a plastic body with two or three metal leads extending out of the bottom of the package. The most common type of 3-lead versions have the leads arranged in a triangular layout. All TSP TO-92-III packages feature an exposed die within the body of the package, which provides better thermal control and more contact area with connecting components. TO-92-III package provides superior performance when compared to other package styles. It provides excellent protection against moisture, dust, shock, vibration, and other environmental hazards. The package also offers superior thermal and electrical performance. The aluminum leads offer excellent electrical contact and superior thermal management, which increases the reliability of the components. TSP TO-92-III package features a reliable sealing method that uses a lid-sealing process to protect the semiconductor device. The lid of the package is secured with a resin-based material which creates a hermetic seal. This seal prevents the ingress of air, moisture, and contaminants. TO-92-III package is cost-effective and time-saving to install, as the package does not require manual soldering and can be easily integrated into automated printing systems. Additionally, the hermetic lid seal eliminates the need for additional encapsulation and gluing processes. TSP TO-92-III package is ideal for applications that require high-reliability and miniaturization, such as in automotive and telecommunication applications. It is also well suited for use in temperature-sensitive applications, as it offers superior thermal performance. Additionally, TO-92-III package is compliant with RoHS, REACH, UL, and CSA standards.