Used TSP TO-92S-III #9150624 for sale

TSP TO-92S-III is a custom electronic packaging system, designed to protect integrated circuits (ICs) from physical and environmental damage, and to enhance their performance. It is a special set of components and components' assembly, used for mounting the ICs. TO-92S-III belongs to the Transistor Outline (TO) family - a series of widely used packages for semiconductors like transistors, diodes, resistors, and capacitors. TSP TO-92S-III encloses the ICs in a plastic casing. It consists of multiple parts - a round case, base and lead frames, and a cover with an integrated heat sink. All the components are designed for simultaneous suspending and trimming of the ICs. The package has an opened leadframe, which keeps the ICs in perfect alignment and facilitates the soldering process. The base is connected with the leadframe and the cover using a snap-fit mechanism, which enhances the mechanical protection of the components. The plastic cover is sealed with an epoxy resin, in order to prevent environmental damages. TO-92S-III is one of the most popular packages for ICs, as it provides excellent thermal and space efficiency, along with moderate electrical performance. The package is available in three different types - single part, two-part, and three-part package. The single part package is a compression molded item, with pins connected to the lead frames directly attached to the case. The two-part package provides more flexibility, as it offers the option of mounting the IC before or after soldering. The three-part package is soldered to the PCB before the ICs are mounted, and has numerous pins for more stable connection and better electrical performance. In terms of electrical performance, TSP TO-92S-III offers low thermal resistance, high insulation resistance, low component inductance, and high noise immunity. Moreover, it has an extended temperature range (up to -55°C to +150°C) and it is capable of dissipating up to 0.75W of power, making it suitable for most general-purpose applications. TO-92S-III is also RoHS compliant, meaning it is mechanically and electrically reliable, and conforms with the safety standards. In conclusion, TSP TO-92S-III is an excellent packaging system for ICs as it offers superior protection, along with excellent thermal and electrical performance. Its snap-fit mechanism, wide temperature range, and RoHS compliance make it one of the widely used packages for integrated circuits.