Used AIRVAC / ZEVAC DRS 24C #9162396 for sale

AIRVAC / ZEVAC DRS 24C is a PC board assembly and manufacturing equipment designed for automated component placement, inspection, and final assembly of Electronic Control Units (ECUs), Printed Circuit Boards (PCBs) and other electronic components. ZEVAC DRS 24C is a fully multi-functional system equipped with a range of placement and inspection capabilities that include a 2-position vacuum pick-up head, a 3-position pick-and-place head, and an advanced inspection package. The unit also incorporates a robust conveyor machine that supports up to 5 operating modes, including continuous, indexing, and shuttle. The vacuum pick-up head is used to pick up and place components from the component feeders, such as Surface Mount Technology (SMT) components, integrated circuits (ICs), resistors, diodes, and capacitors. The 3-position pick-and-place head is used to place through-hole components and can handle components up to 25 mm in size. The head is equipped with a precision positioning tool that ensures accurate placement of components. The inspection package uses a combination of 3D scanning, optical inspection, and 3D image processing to detect and correct any defects in the placement and assembly of components. The in-line inspection process allows for a quick output of results that can be used for real-time adjustments to the assembly process. The fully integrated conveyor asset eliminates manual movements of the PC boards throughout the assembly process and reduces the need for operator intervention. The conveyor model offers 5 speed levels and can be set to either continuous or indexing mode to accommodate different levels of production. AIRVAC DRS 24C offers a reliable, efficient, and cost-effective solution for the production of high-quality PC board assemblies. The equipment automatically inspects and detects component placement and assembly errors, ensuring the highest quality of production. In addition, the system is designed to accommodate a wide range of components and supports both through-hole and surface mount technology components.