Used ASM BGA BP 209 #151127 for sale

ASM BGA BP 209 is a fully automated, high throughput, pc board assembly and manufacturing equipment. It is designed for medium to high-volume electronics manufacturing and can accommodate boards up to 570mm x 500mm. It is capable of supporting a broad range of component types and sizes as well as BGA and micro BGA packages on bottom side only. The system is based around an industry-renowned, SWAP-C technology which combines highly accurate placement and assembly with a specially designed optimised, in-line process to maximise efficiency. The SWAP-C technology ensures a high level of component placement accuracy, repeatability and reliability, with accuracy of placement on 0201 components better than 0.040mm. In addition, the unit is equipped with a palletised feeder handling machine which provides a high throughput of components while simultaneously reducing component feeder inventory costs. It has an impressive component capacity, with up to 960 component feeders and 8 pallet carriers with 24 slots each. The tool is also capable of handling multiple component types and sizes, including Fine Pitch BGA, uBGA, and QFP. The asset also boasts an advanced vision model for inspection, enabling the verification of part placement accuracy and quality. The vision equipment is designed to detect component skew, component presence, rotation, component offset and missing components, as well as bridging, tombstone, PCB damage, component missing and component polarity. The system converts these signals back to the controller, allowing adjustments to be made, which helps to ensure consistent throughput and piece performance. In terms of process control, the unit utilizes an advanced SPC (statistical process control) monitoring machine. This tool monitors every step in the production process, providing real-time process data and comprehensive traceability. It is designed to ensure that the quality of components is consistently maintained and all parameters are met. BGA BP 209 asset is an advanced, comprehensive solution for pc board assembly and manufacturing. It is designed to provide accurate placement and assembly, exceptional quality, and reliable throughput. With its automated handling model and advanced vision equipment, it is an ideal solution for medium to high-volume electronics manufacturing requirements.