Used ASYS TDM 03 #9296239 for sale

ASYS TDM 03 is a high-end PC board assembly and manufacturing equipment from ASYS which has been designed to meet the most demanding requirements. The system is capable of constructing complex printed circuit boards with intricate designs and can assemble extremely precise, tight tolerance components, making it ideal for production of high-density, high-precision circuit boards. TDM 03 features a versatile modular design that can be tailored to meet specific customer needs and requirements. The unit contains two independent modules: the Ball Grid Array Fiducial and Tail Aligner (BGFT) and the Placement Machine (PM). The BGFT is responsible for accurately aligning and reflecting fiducials, while the PM is designed for the precise placement of devices onto the board. The BGFT is equipped with an advanced series of sensors that are capable of scanning, detecting, and interpreting fiducial marks on the circuit board accurately and quickly. The PM is powered by an industrial-grade robotic arm that lends precision and speed to the placing process. The arm is controlled with an advanced vision-based control machine that guarantees accurate placement and orientation of components, even on complex PCBs. ASYS TDM 03 also includes advanced slicing technology that can be used to accurately monitor and control the process. The PCBA structure is divided into a series of pieces, enabling users to visually check for errors in the visual representation without having to manually inspect each component. The precise adjusting ability of the tool allows users to make the necessary adjustments in real time without needing to stop production. Additionally, TDM 03 comes with a variety of useful features such as a component library, a job library, and a project management asset, making it easy to manage and store data. Furthermore, the model is supported by comprehensive technical support, making it easier for users to keep the equipment running at optimal performance. All in all, ASYS TDM 03 is an excellent assembly and manufacturing system for PC board fabrication. With its advanced placement technology, advanced control systems, and comprehensive support package, TDM 03 provides a reliable and highly efficient unit for rapidly constructing complex PCBs.