Used ASYS TDM 05 #9383332 for sale
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ID: 9383332
Vintage: 2005
Shuttle
Variable operating modes
Electrical width adjustment
Options:
Transport height: 950 mm ± 50 mm
Automatic width adjustment
Control function
2005 vintage.
ASYS TDM 05 is an integrated equipment designed to help optimize the process of pc board assembly and manufacturing. It is ideal for medium to large scale electronics manufacturing facilities due to its automated process control and optimization features. The system comprises of a variety of components that help streamline and improve the pc board assembly process. The main components are the pick and place machines, the automated-optical-inspection (AOI) machines, and the reflow ovens. The pick and place machines automate the process of component placement on the pc boards. They feature multiple heads that move quickly and accurately along the pc board lanes, picking and placing components where they need to be. They also have a built-in vision unit to assist in more precise placement of components. The AOI machines are used to check for any faults during the assembly process. They feature a built-in camera and computerized machine that can detect any errors or defects within the pc board components. This helps to reduce the cost of repair and replacement due to faulty pc board components. The reflow ovens are used to solder the components on the pc boards. The ovens feature a temperature-controlled tool that maintains a consistent temperature, providing a uniform and safe setting for the assembly process. The ovens also feature an error detection and prevention asset that quickly alerts the operator of any issues or potential issues with the assembly process. Overall, TDM 05 provides an integrated and automated model for pc board assembly and manufacturing. Its automated processes help to reduce labor and material costs associated with the assembly process, while its error detection and prevention systems help to improve the quality of the finished product. This helps to increase the efficiency and consistency of the pc board assembly process, while reducing costly defects.
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