Used ASYS WS 01 #9263020 for sale

ID: 9263020
Vintage: 2017
Flip station Monorail Track width range: 0-500 mm Track length: 500 mm Belt transmission method Power supply: 230 V, 0.2 kW Communication interface: SMEMA / SIEMENS 2017 vintage.
ASYS WS 01 is a pc board assembly and manufacturing system that is capable of producing high-quality and complex printed circuit board assemblies. The system is made up of several components, including an automated pick-and-place component, an automated stencil printing component, a rework station, a board cleaning component, and a solder deposition component. The automated pick-and-place component is responsible for rapidly placing components onto the printed circuit board (PCB). This is achieved by placing device carriers onto a conveyor belt and then using high-speed robotic arms operated in a sequence to accurately position each component onto the printed circuit board. The robotic arms also apply a precise amount of force to ensure that each component is fixed firmly in place. The automated stencil printing component is used to accurately and quickly deposit paste onto the board. This is achieved by pressing a pre-cut metal stencil down onto the board, which then squeezes paste out from the openings in the stencil onto the desired locations on the circuit board. By controlling the pressure applied and the speed at which the stencil is moved, an even and consistent paste deposition can be achieved. The rework station is used to make changes to a PCB if required. This can include removing components, moving components, or adding components. This is achieved by using specialized tools that are precise and accurate and can be applied to the board with different degrees of heat depending on the component and the type of change that is being made. The board cleaning component is used to ensure any residual flux or foreign particles are removed from the board, which helps to maintain optimal performance. This is achieved by using a combination of mechanical scraping and heated high-pressure air to fully remove any contaminants. The solder deposition component is used to attach components to the printed circuit board by transferring a molten solder to the board via a specialized heating element. This can be done in a number of different ways, such as by using a solder paste or by utilizing a wave soldering technique. Overall, WS 01 is an advanced and comprehensive pc board assembly and manufacturing system that is capable of producing high-quality and complex PCB assemblies with minimal human input. By utilizing the automated pick-and-place component, automated stencil printing component, rework station, board cleaning component, and solder deposition component, it is possible to produce PCB's that are of a consistently high quality and have minimal human error.
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