Used CYBEROPTICS LSM #9101630 for sale

CYBEROPTICS LSM is a equipment which combines both pick-and-place and non-contact AOI into a single unified line-side manufacturing system to deliver a total solution for PC board assembly and manufacturing. It provides a configurable solution for assembly lines from low to high-volume production. The pick-and-place function of LSM features two families of machines - the MMS and MLP ultra-high speed placement systems. These systems feature advanced servo-driven placement heads for further precision and flexibility. The MMS model also features an integrated vision unit with integrated ultra-high speed 3D AOI, and also supports high-mix jobs. The non-contact AOI machine with integrated ultra-high speed 3D AOI from CYBEROPTICS LSM combines advanced optics with smart algorithms and a unique triggering mechanism to provide ultra-high speed 3D AOI. This tool provides a breakthrough in accuracy and repeatability with its patented laser scanning technology which enables 100% inspection across the entire board. The asset is further enhanced with automatic defect recognition and multiple algorithms for verification and decision making in real-time. LSM helps save time and money by delivering ultra-high speed 3D AOI and up to 108 trays/h with integrated tray loading station for a mixed-line solution. It also features advanced process and yield analysis with detailed real-time feedback that helps in optimizing assembly lines and speeding up production. Built on a CANBus framework, the model brings seamless integration with existing MES/ERP solutions and other common automation equipment. CYBEROPTICS LSM's multi-sensor technology and advanced chip recognition provides a global coverage with ultra-high speed 3D AOI. It also supports a wide range of products at a fraction of the cost of traditional AOI systems. The equipment is further enhanced with 99.9999% accuracy and repeatability of ultra-high speed 3D AOI as well as advanced process and yield analysis. It also features multiple intelligent decision-making algorithms for automatic defect recognition. In conclusion, LSM is an ideal solution for PC board assembly and manufacturing. It combines both pick-and-place and non-contact AOI technology into one unified system delivering ultra-high speed 3D AOI that provides a breakthrough in accuracy and repeatability. It also features advanced process and yield analysis and can be easily integrated with existing MES/ERP solutions. The unit delivers a total solution for the lowest cost compared to traditional AOI systems.