Used CYBEROPTICS SE 300 #105812 for sale

CYBEROPTICS SE 300
ID: 105812
Vintage: 2003
Solder Paste Inspection System, 2003 vintage.
CYBEROPTICS SE 300 is a PC board assembly and manufacturing equipment designed to meet the high production and quality requirements of automotive and industrial applications. Built with a high degree of modularity, it provides a range of software and hardware options that can be fully customized to meet the specific needs of the customer. The machine provides three-dimensional measurement and solder paste inspection capabilities to ensure that components are accurately and consistently placed on the board in order to reduce defects and improve quality. The system also performs soldering, component extraction and rework, marking and appearance testing to ensure consistent quality. The unit is designed with a high level of automation to reduce operator fatigue while providing a high throughput of precise assemblies in a reliable manner. The machine features a high degree of motion control, with servo drives and stepper motors, allowing precise placement of components and precise control of soldering parameters. It also includes a wide variety of sensors, switches, and control outputs to monitor process progress and component placement. The tool's intuitive user interface, which includes touch screens, PCs, and data storage facilities, allows easy navigation and allows operators to quickly set up the process and monitor all processes during operation. The asset is also equipped with advanced features such as a selectable trajectory option, allowing the model to move in different directions to reduce component damage and to allow precise component location. It also provides multiple process information windows, so operators can review and adjust factory settings while the process is running, providing further control and efficiency. Additionally, it is equipped with an audible alarm to alert operators when an issue is identified. The equipment's modular design makes it incredibly versatile and, by using different modules and configurations, it can be tailored to almost any application. It is capable of working with a variety of assembly materials, such as SMD components, through-hole components, and other features like wave soldering, pick and place, and laser marking. Overall, SE 300 provides an effective PC board assembly and manufacturing solution in a highly automated, intuitive, and customizable package. Its ability to combine high-speed performance with ultra-precise accuracy provides users with an ideal solution for their production and quality needs.
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