Used CYBEROPTICS SE 300 #9098426 for sale

CYBEROPTICS SE 300 is a high performance pc board assembly and manufacturing equipment designed for the most cost effective and reliable production of printed circuit board (PCB) assemblies. SE 300 system utilizes a scanning laser displacement sensor to accurately measure the position and orientation of solder paste, components, and boards when applied to a manufacturing process. This ensures accuracy and repeatability, providing maximum yield and consistent performance. The unit features a wide variety of intelligent consumables that can sense the presence of solder paste and components, and can be calibrated for volume, thickness, and placement accuracy. There is also the ability to use a variety of adhesives to create the necessary gap fill, allowing for improved solder wetting and mechanical bonding. Additionally, automated laser-focused optical inspection techniques work in combination with CYBEROPTICS SE 300 machine to provide additional feedback for quick analysis and rework, as well as options for manual or automatic rework. SE 300 is designed to incorporate error-proofing techniques such as dimensional verification, zoom-in solder joint inspection, 3D solder joint strength testing, component placement verification, and more. Additionally, traceability technologies such as unique bar codes and serial numbers enable quick retrieval and record keeping of specific histories for error analysis, as well as total production tracking. CYBEROPTICS SE 300 enables precision placement of components, with single components being placed down to 25 microns in placement accuracy. For smaller components, a special force-based placement method allows accurate placement from 100 microns and up, accommodating a wider range of component sizes and types. Additionally, multiple solder paste dispensing nozzles can be used in an array to provide precise dispensing and repeatability on larger boards. SE 300 tool has been designed for optimal production reliability and throughput, with fast conveyor designs that can provide up to 2500 components per hour. The asset also includes advanced features for signal integrity, including impedance optimization for high-speed board applications, allowing for improved signal transmission and model performance. Additionally, the equipment features an integrated system for component electrical testing, allowing for easy production of circuit boards with fewer eventual board failures.