Used CYBEROPTICS SE 500 #9133304 for sale

CYBEROPTICS SE 500 is a versatile and reliable pc board assembly and manufacturing equipment designed to facilitate high-volume, cost-effective precision assembly of components. Equipped with a number of advanced visual inspection, pick-and-place, and reflow soldering technologies, CYBEROPTICS SE500 ensures that pc board assembly is produced to the highest level of accuracy. In terms of installation and maintenance, SE 500 is highly user-friendly. Its integrated control software and user-friendly interface allow the system to be optimized for a wide range of applications, from small-scale prototypes to high-volume production. The unit also features a range of debug, test, and validation features to identify potential problem areas and ensure that every board meets its specific requirements. SE500 is equipped with an advanced multi-axis rotational assembly platform that allows for flexible component placement in three dimensions. This ensures that components are consistently positioned and soldered accurately, while reducing overall manufacturing time. The machine is further capable of handling components ranging in size from 0402 to 50x50mm and ranging in thickness from 0.2 to 5mm. In terms of accuracy, CYBEROPTICS SE 500 also features advanced 2D and 3D vision inspection technologies that allow for both post and pre-seller verification. This ensures that components are correctly positioned and soldered in accordance with pre-defined parameters, while simultaneously detecting any defects in soldering or component placement. CYBEROPTICS SE500 is also equipped with a range of advanced testing and control features. These include high-speed SMEMA communication and a selection of automated inspection and test plugins for analyzing timing and power performance of the pc board assembly. The tool is also capable of automatically testing pc board assembly for fault and intermodulation compatibility and can be equipped with additional peripheral products such as vision cameras, manual assistance tools, and barcode readers to facilitate automated quality control. To ensure that certain board designs can be accurately realized, SE 500 features a range of component design and placement options. This includes the ability to switch between stencil and soldering paste operations, allowing for different deposit configurations, ranging from multiple thinner lines to wider pads. It also allows for component placement optimization, while utilizing the asset's optimized reflow soldering technology. Overall, SE500 is an advanced and cost-effective pc board assembly and manufacturing model that offers organizations the ability to rapidly and accurately produce components to very high standards of accuracy. With a range of advanced visual inspection, pick-and-place, and reflow soldering technologies, the equipment ensures that board assembly is produced to the highest level of accuracy, while also helping to optimize production time and costs.