Used FINETECH Fineplacer #9263294 for sale
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FINETECH Fineplacer is a high precision PC board assembly and manufacturing equipment designed and manufactured by FINETECH for assembly of highly complex electronics products. The system was specifically developed to meet the needs of the most stringent requirements for the production of high quality, high density, and low volume electronic components. It features a fast placement unit and a special motion unit along with high quality components to maximize accuracy and productivity. The core of Fineplacer is the fast placement unit, which consists of a linear array of four independent high speed placement heads driven by independent X-Y-Z axes. The placement heads work simultaneously under the control of an optimized motion path to accurately move components from the feeder to the board. The placement heads feature double placement accuracy, dual vision systems for tracking components, and a three-mode configuration for automated, manual or hybrid operations. In addition, external components can be placed accurately onto the board using the optional external placement head. FINETECH Fineplacer supports a wide range of component sizes and types with a precision of up to 0.02mm. The exchangeable sub-placers are available for specialized tasks such as component placement on panels and odd-shaped substrates. The electronics assembly machine is equipped with automatic vision and quality control systems for real-time monitoring of its processes. Its Material Handler and Activity-based Placement Systems manage logistical processes for feeding, placement and testing of components. It can support offline programming of the placement unit for maximum performance. Furthermore, the tool is capable of carrying out post-placing processes such as the application of solder paste, automatic optical inspection, insulation displacement connections and soldering. It integrates with select software, making it compatible with the most demanding production lines. Fineplacer is ideal for automated electronics manufacturing of high density and high mix production. It offers users an efficient and cost-effective solution for increased time-to-market, production flexibility and reduced maintenance costs.
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