Used FLUID RESEARCH 6330 #9068991 for sale

FLUID RESEARCH 6330 offers a complete, automated solution for PC board assembly and manufacturing. The equipment is designed to increase the production efficiency and accuracy while reducing costs. It uses liquid dispensing technology that allows the precise placement of components for rapid assembly. The system also includes automated optical assessment which ensures accurate placement of each component. 6330 unit includes a powder to paste dispensing module and an advanced vision machine. The module is modular and offers flexibility in configuration and operation. The tool is capable of processing a variety of standard and custom components to meet specific product requirements. The vision asset checks for any flow irregularities and can detect misaligned components as well as incorrect polarity. Both of these allow the production of high quality products with shorter cycle times. The powder to paste module delivers consistent deposits of paste onto the PCB placement area. The module is equipped with a high-temperature nozzle that rapidly heats the paste. This allows for fast and accurate deposition onto the board. An adjustable vacuum platen allows the correct pressure for formula accuracy. FLUID RESEARCH 6330 model can handle a variety of paste formulas and speeds up the paste application process. The vision equipment consists of two separate cameras for precision alignment. The vision system incorporates object recognition to accurately identify components and ensure placement accuracy. It also includes feedback on quality and allows for repair if needed. The vision unit also incorporates a variety of features to ensure complete and accurate data collection. This data is used to continuously improve product quality. 6330 offers cost savings through its efficient and accurate production. The quick set-up time and efficient cycle time allow for multiple production cycles in the same day with fewer steps. The accuracy of the vision machine ensures more accurate production which reduces unnecessary scrap and misplacement. The tool is also capable of high throughput production with minimal downtime. It is an ideal solution for PC board assembly and manufacturing needs.