Used FUJI CP 732E #147337 for sale
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ID: 147337
Chip shooters
Components per hour (placement speed): 0.068sec/part (52,941 part/hr)
Placement accuracy: +/- 0.066mm (3σ)
No of placement heads and nozzles per head: H20
Feeder capacity,number, and type of feeders: 8mm 60 with two table
Max pcb size: MAX 356x254mm, MIN 50x50mm(W)
Component range:0603 to 19x19mm, Height-6mm
Board loading time:1.4sec/board
Vision inspection system: CCD camera
Fuji Service records available
2000-2001 vintage.
FUJI CP 732E is a pc board assembly and manufacturing equipment specifically designed for high mix low volume applications. With a unique twin-track design, CP 732E streamlines pc board production and assembly, allowing for highly efficient turnarounds and significant optimization. Capable of complex solder patterning, reflow soldering and Chip-on-Board production, FUJI CP 732E provides comprehensive pc board assembly services. CP 732E consists of several modular components, allowing for complete customization to fit the specific demands of each application. In particular, FUJI CP 732E features a feeder system with up to 120 feeder capacity, with each position capable of accommodating components ranging in size from 1005 to 344240. Furthermore, the feeders can accommodate both traditional E- and IC-type components, to provide even greater flexibility. Additionally, CP 732E features a flexible placement head, able to load components ranging from 0603 to 420x420mm and equipped with a 90 tilt head for optimal placement accuracy. FUJI CP 732E also features a powerful imaging platform, capable of taking readings from up to 12 cameras. The unit also includes advanced, integrated viewing capabilities for improved accuracy, allowing for angle correction and interferometry checks. This ensures the highest level of accuracy from the machine. Moreover, CP 732E is capable of tracking multiple panel profiles, allowing for quick process switching for quick and efficient production. For its soldering capabilities, FUJI CP 732E includes MaxSoldering QFP, PLCC and BGA. Furthermore, CP 732E features a lead-free process control module, ensuring consistent quality in each soldering process. Lastly, FUJI CP 732E is equipped with a Chip-on-Board (COB) module, which utilizes a combination of vacuum, welding, and occlusion technologies in order ensure that each chip is securely and accurately attached to the board. As a whole, CP 732E is an advanced pc board assembly and manufacturing tool that offers high levels of performance, reliability, and accuracy. With its multiple modular components, flexible feeders and imaging asset, FUJI CP 732E provides highly-optimized production capabilities for high mix, low volume applications.
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