Used FUJI GLV #147357 for sale

ID: 147357
Glue Dispensing Machine with vision correction PCB Dimensions: Max: 508x457mm (20’’x18’’). Min: 80x50mm Dispensing Speed: 0.13 sec/dot (with glue application 0.05sec and movement not further than 10mm) Number of Sequences: Max. 5000 sequences/program Glue Application Accuracy: ±0.15mm (using fiducial marks) Data processing: F4G or MCS/2 (MCS30) Power: 3-phrase, 200 to 480 VAC, 2.0kVA Air Consumption: 0.5M Pa (5 kgf/cm2), 150 Nl/min Options: Coller Centrifuge Helps.
FUJI GLV is a pc board assembly and manufacturing equipment developed by FUJI Corporation. The system combines the features of automatic soldering, conformal coating, and laser processing for high-precision electrical and mechanical assembly work. GLV utilizes several key technologies, including integrated motion control technology, automatic reflow soldering, lithography station control technology, surface mount technology, and glue management technologies. The integrated motion control technology employed by FUJI GLV unit helps to ensure an accurate, reproducible solder joint in every application. This technology utilizes a patented motion distance algorithm that helps to reduce motion disturbances to deliver precise motion control, which aids in the assembly of pc boards. The machine also utilizes several types of reflow soldering to help ensure a strong, reliable joint in all assembly applications. GLV is also equipped with automatic conformal coating technology, which helps to prevent electrical or corrosive damage to the assemblies and increase the shelf life of the product. FUJI GLV tool also includes laser processing technology. This technology helps to reduce process times, increase yields, and reduce labor costs by allowing for higher speeds for removal and positioning of components. The asset also features laser alignment and pattern recognition to precisely position components, reduce the chance of solder mistakes, and increase process accuracy. GLV model also features several surface mounting technologies (SMT) such as placement, inspection, and repair of components. The equipment includes an array of specialized equipment and software tools, such as placement systems, nozzle cleaners, position detectors, and laser aligners, to help ensure efficient, accurate production of pc boards. The system also assists with platform-specific control and subsystem operation, increasing process control and accuracy. Finally, FUJI GLV also features several glue management technologies. These include nozzle control, glue-head maintenance, and process control of glue dispensing, which helps to reduce waste, minimize leaks, and increase assembly quality. Overall, GLV is an advanced pc board assembly and manufacturing unit that offers a wide range of features and technologies to achieve increased accuracy and reliability in assembly. The machine utilizes several key technologies, including integrated motion control technology, automatic reflow soldering, lithography station control technology, surface mount technology, and glue management technologies, to help ensure precise assembly and operation of pc boards.
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