Used FUJI NXT I M3S #9217301 for sale

FUJI NXT I M3S
ID: 9217301
Vintage: 2006
Modular placing machine 2006 vintage.
FUJI NXT I M3S is a mid-range PC board assembly and manufacturing system that offers high performance and flexibility for complex assembly applications. NXT I M3S combines a multi-stage pick and place head, high precision end-effector components, and a combination of automation control and software features to provide a high-speed, repeatable and reliable solution for high-volume PCB assembly and manufacturing. The multi-stage pick and place head integrated in FUJI NXT I M3S allows for the accurate transfer of components to the PCB surface. High precision end-effectors and advanced auto- alignment technology is employed to ensure accurate placement with each cycle. The combination of automation control and software features enhances production speed while providing reliable and repeatable processes. This includes features such as user-friendly touch screen control, real-time process data displays, error tracking and automatic data logging for production analysis and traceability. NXT I M3S includes component placement capabilities for a wide variety of components ranging from conventional fine-pitch lead components to surface-mount micro BGA components. High-temperature reflow soldering is provided using either batch conveyor or selective soldering modes, with beyond-visual-inspection verification options for 100% verification. Selective soldering options are also available for leadless components. FUJI NXT I M3S also features automated optical inspection (AOI) to detect defects as small as 0.8mm, while process protection options are available to prevent damage to components during soldering. NXT I M3S is designed to be a flexible and reliable production system for high-volume PCB assembly and manufacturing, offering high performance and repeatability and automated optical and process protection features. The system is capable of accommodating a wide range of components, including ultra fine-pitch lead components and surface-mount micro BGA components, facilitating efficient and reliable PCB assembly production.
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