Used FUJI NXT II / XPF #9055612 for sale

FUJI NXT II / XPF is a high-performance PC board assembly and manufacturing equipment marketed by FUJI Machine Technology Corporation. It is the latest innovation to their series of next-generation PC board printing and assembly tools, designed to meet the ever-emerging requirements of the electronics industry. The XPF system has a wealth of features, making it one of the most comprehensive boards assembly systems available. It offers a comprehensive set of non-linear total board production technology, with manufacturing capability from circuit board creation through to component placement, soldering and inspection. Utilizing the latest technologies, NXT II / XPF offers high accuracy and speed with high quality printing and assembly. A standard feature of the unit is a triple-track conveyor, to handle up to two-hundred and sixty-five boards simultaneously. The advanced conveyor design reduces stress on the boards and components, resulting in lower defect rates. The XPF machine also offers a range of precision print technologies. The Sure Print QD multi-colour printing tool uses a blower-driven nozzle design to eliminate rejects due to mis-registration. It also features a 'perfect finish' capability, producing superbly textured paints and inks for a highly aesthetic finish. For maximum throughput, the XPF also has an ultra-highspeed multilayer printing modules with a maximum printing speed of 8.5m/min. The NXT II uses a combination of Vision Pick-and-Place as well as conventional assembly techniques. This allows for very high placement rates of up to 25,000 cph. In addition, the asset is capable of placing components on both sides of the board simultaneously, enabling full flexibility in where components are placed on the board. The XPF model also features a comprehensive range of soldering options. The Integrated Hot Gas Soldering (IHGS) Equipment utilizes a range of advanced technologies to quickly and precisely secure all components to a board in a single process. It has several options, including high-temperature soldering, ultrasonic soldering and lead-free soldering for RoHS compliance. SEE can also conduct a range of detailed inspections, including visual, 2D and 3D inspection, verify letter ID patterns, identify PCB cracks or warpage, and perform basic BGA inspection and rework. This allows for rapid and accurate quality control when dealing with tight tolerances. In summary, FUJI NXT II / XPF is an advanced PC board assembly and manufacturing system that is designed to meet the ever-increasing needs of the electronics industry. This unit is equipped with a range of features including multi-layer printing, high-speed component placement, and comprehensive soldering and inspection capabilities, all working together to create a highly efficient and precise production process.