Used FUJI XPF-S #9245593 for sale

ID: 9245593
Chip mounter.
FUJI XPF-S is a PC board assembly and manufacturing equipment that allows for efficient and rapid production of high quality circuit boards. It is a modular system with a variety of different components and components combinations to meet customers' production and process requirements. This highly customized unit is ideal for small to medium-sized production, allowing for flexible throughput and customization during production to meet the exact requirements of those products. It is equipped with a variety of automation and measurement options, such as pick and place, inspection, SMT post-stencil and post-reflow to help ensure maximum quality results. The core of the machine consists of a head mechanism with an integrated vision tool, a main motor, and a servo-controlled conveyor asset. The vision model inspects components and checks solder paste before it reaches the PCBs, preventing any defects or damaged board. If any defects are detected, they can be quickly changed, enabling rapid operation and production. The main motor can be configured to optimize for speed or precision, allowing for reliable and consistent operations for higher quality boards. The servo-controlled conveyor equipment provides a fast and efficient way to transfer PCBs regardless of size or weight, giving users the flexibility to fine-tune the conveyor speed to meet the needs of the specific application. The system also includes additional features and functions to optimize board assembly production, such as a board loading option, a de-panelizing and lamination feature, an SMT attachment option, and a post-stencil reflow option. The board loading option allows for quick loading and unloading of raw boards and panels, while the de-panelizing and lamination feature securely attaches multiple PCBs onto a single panel without fear of damage, assisting in cost savings. The SMT attachment option provides a reliable and repeatable process for attaching components such as chips, resistors, and inductors to the board assembly. Lastly, the post-stencil reflow option helps provide the required soldering and fluxing temperature profiles to ensure stronger, reliable solder joints. Each of these functions are designed with precision and quality in mind helping to provide the highest quality assembly results. Aside from providing a highly adjustable unit that meets the needs of the product being produced, the Fujitsu XPF-S is also easy to maintain and has a compact design, making it ideal for environments with limited space. This compact machine makes it an attractive option for those looking to increase production. With the help of its different features and automation capabilities, FUJI XPF-S can save both time and money while providing reliable and consistent results.
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