Used HANWHA SRF30124NS #9302248 for sale

HANWHA SRF30124NS
ID: 9302248
Vintage: 2010
Pick and place machine 2010 vintage.
HANWHA SRF30124NS is an advanced semiconductor production solution designed to support the fast, accurate, and highly efficient manufacture of circuit boards and electronic components. The equipment features advanced fabrication technology, offering the highest levels of repeatable product quality while also providing a rapid turnaround for new product designs. The system is built upon a modular architecture providing a maximum level of flexibility and scalability. SRF30124NS is composed of several integrated components and subsystems, such as a fluxless soldering IR evaporator, thermal cycle switching, R/F hot air systems, a degassing unit, a loader and unloader, and an inspection unit. This combination of technologies offers a powerful manufacturing platform for rapidly producing products with a high degree of accuracy and repeatability. The fluxless soldering IR evaporator provides a solutions for dispensing and curing of different types of solder pastes. The vapor droplets are evenly distributed throughout the board and land directly in the right places. This technology is of particular interest, since it eliminates the need to manually apply flux to the board. Additionally, this evaporator provides heat curing, ensuring a reliable soldering connection. The thermal cycle switching technology uses temperature gradients to precisely manage the flow of temperature throughout the board. This ensure that materials do not warp or shift during the reflow process, eliminating the need for manual inspection and the possibility of defects. The R/F hot air systems create fine features in large scale SMT production, enabling high levels of accuracy and quality. This apply to both the attaching, and alignment of components onto the boards You can use a number of different nozzle sizes and reflow ranges for sensitive components. The degassing unit eliminates trapped gases from boards and components, ensuring consistent solder joints. This is especially important for BGA components. Uni-Load and Unloader performs transport layer movements of the boards to eliminate the need for human intervention in the workflow. Capacity range is from 400 up to 1,200mm x 400mm. The inspection machine is used to identify defects in completed boards. This tool is capable of detecting missing components, misalignment of components, and damaged solder joints. Ultimately, HANWHA SRF30124NS combines a high degree of flexibility, scalability, and repeatable accuracy into a powerful production solution. Its modular architecture allows users to deploy the asset without the need redesign the underlying operating framework or to replace any of the major components. This makes it an ideal solution for large-scale SMT production, testing and manufacturing.
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