Used HITACHI HLM-A60F #9389334 for sale

HITACHI HLM-A60F is a state-of-the-art pc board assembly and manufacturing equipment. It is a high speed, high precision, and selective deposition technology (SDT) platform that is designed to meet the most demanding requirements within the pc board assembly and manufacturing industry. HLM-A60F provides a wide panel size that is capable of processing pc board panels ranging in sizes up to 610mm by 445mm. The system can be configured with up to seven component placement locations for a maximum of 15,000 component placements per hour. The electromechanical placement head has a unique hand-eye camera unit that helps to improve placement accuracy and consistency. The spindle on HITACHI HLM-A60F is designed to provide high speed, precision, and flexibility, with speeds up to 3,600 rotation per minute also variable depending on the size and shape of the component. An auto-feeding machine accurately feeds two types of components, allowing for multiple components to be processed simultaneously. HLM-A60F is equipped with an omni-directional solderjet tool for both lead-saving bottom side and top side soldering. Its unique nozzle design can be used to solder components with various size and pitch. To ensure uniform and consistent solder deposit, the solderjet asset is equipped with a high precision temperature control unit. The SDT helps to simplify production line setup and reduce set up time, while the built-in double exposure inspection function helps to ensure high accuracy and quality of the end product. It is designed for low cost of ownership as it requires minimal maintenance, and its noise levels are significantly lower than conventional systems. HITACHI HLM-A60F model is also equipped with a lot of advanced features such as the advanced barcode equipment for material management, profile management, and n2 drive system to improve the speed and accuracy in component placement. Its advanced profile creation software also helps to reduce programming time. Overall, HLM-A60F is a reliable and highly efficient pc board assembly and manufacturing unit that is capable of producing superior quality pc boards with maximum speed and accuracy. Its advanced features such as the selective deposition technology and the high precision temperature control make it ideal for meeting the most demanding requirements of commercial and industrial pc board manufacturing.