Used HITACHI TCM-X200 #136288 for sale
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ID: 136288
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HITACHI TCM X200 is a revolutionary PC Board Assembly and Manufacturing equipment designed to reduce time-to-production, improve quality and minimize human labor cost. It offers an advanced and integrated approach to electronic assembly and testing, enabling electronics manufacturers to quickly and accurately manufacture and test their products. The system includes an Inkjet Printer, Hot Air Bonder and Conveying Unit, Automatic Taping Machine, PC Board Off-Loader, and 3D Imaging Scanners. With these components, users can produce complicated assemblies with greater accuracy and precision than ever before. The Inkjet Printer utilizes a large thermal print head to accurately place components on the boards with minimal operator interaction. It also features a built-in 3D imaging scanner that can be used to detect missing components and flag them for replacement. The Hot Air Bonder ensures that components are mounted securely on the boards. Its advanced heating/cooling formula offers precise temperature control for consistent results. Additionally, its intuitive software offers simple control, enabling users to quickly and easily set up a bonder and related equipment. The conveying Machine allows for a reliable and cost effective way of transferring PC boards from station to station. The automatic taping machine ensures that components are accurately placed and taped, leading to greater consistency and better tactile results. Finally, the PC Board Off-Loader further increases efficiency by automating the removal of boards from the tool. With this component, users can quickly and easily transfer boards to the next step of production with minimal effort. TCM X200 offers a simple, unified approach to PC board assembly and manufacturing and significantly reduces the time and money spent during the production process. With its built-in features, it eliminates the need for manual labor, significantly reducing overhead costs while providing users with greater accuracy and speed.
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