Used KOH-YOUNG aSPIre 2 #9199712 for sale

KOH-YOUNG aSPIre 2 is a PC board assembly and manufacturing equipment specifically designed to address the challenges of the high complexity and cost-intensity associated with today's electronics assemblies. The system provides a complete solution for capturing component variations, improving component placement accuracy, accurately controlling production data, reducing glue-ball occurrence, and improving the overall quality of the assembly process. At the heart of the unit lies its advanced digital vision technology, which uses real-time imaging to detect and measure defects and non-conformances in a component before, during, and after the assembly process. The machine also uses a variety of automated processes designed to measure components as accurately as possible. Through this technology, it is able to provide detailed, objective information about the performance of individual components, which can be used to identify problematic parts and improve the performance of the overall tool. ASPIre 2 asset is built on a flexible modular architecture that allows necessary components to be integrated easily and at a lower cost. This includes a PC board handling model that can transport boards between processes, a soldering equipment designed to improve quality and safety, a surface mount technology (SMT) placement system configured to meet the demands of high-volume PCB production, and a tooling unit designed to allow precise, repeatable component placement. The machine also includes advanced data acquisition and management capabilities, designed to capture production data and manage the assembly process at the highest possible level of accuracy. In combination, these capabilities enable KOH-YOUNG aSPIre 2 tool to provide improved production efficiency, greater yield, and enhanced safety. By utilizing repeatable, high-fidelity processes, it allows for further optimization of the production process and improved overall quality in the end product. The asset also includes comprehensive traceability and detailed analytics capabilities, providing comprehensive analysis of performance across the entire process. These features further allow manufacturers to identify and address weak points in the assembly process, enabling continuous quality improvement.