Used KOH-YOUNG KY 8030 #9241616 for sale

KOH-YOUNG KY 8030
ID: 9241616
Solder Paste Inspection system (SPI).
KOH-YOUNG KY 8030 is a high-end machine for the automated assembly and manufacturing of Printed Circuit Board (PCB) assemblies. It is composed of multiple modules with the core module being the main inspection equipment, which allows for the automated, precision accuracy inspection of critical components of the assembly. The main inspection system consists of six main items: an optical vision unit, an X-Y robot, an edge inspection machine, a 3D laser sensor, a measurement station, and a bottom camera. The optical vision tool is designed to facilitate high-accuracy vision inspection of fine-pitch SMDs and other components. It allows for drift alignment from the PCB, as well as a detailed analysis of the orientation and component placement accuracy. This is done through a combination of lighting colors and optical patterns, which can detect even the slightest mis-alignment. The X-Y robot is designed for the separation and transfer of components on loaded PCBs. The robot can also be used for 3D paste inspection, as well as solder inspection and rework. It also has an auto-calibration regime, which can be used to improve accuracy over time. The edge inspection asset (or EIS) is used to inspect the presence and quality of all ball grid arrays before placement of components on top of them. It uses three cameras to track each ball grid array, and detect any defects in array formation before they are soldered. The 3D laser sensor is used for automated fiducial alignment. It allows the robot to accurately identify the correct location for placement of components, and reduce the risk of mis-alignment. It is designed for both flat-surface boards and over-molded boards, and can detect even the smallest movement and misalignment within milliseconds. The measurement station is a high-speed model for in-line dimensional measurement of the board and inspected components. The station evaluates the dimensions of every component to compare them with design data, for accuracy and quality control. Finally, the bottom camera is designed for solder inspection of all SMDs and other components on the assembly. It is equipped with lighting and custom filters for error recognition, ensuring quality and precision accuracy of the assemblage. With the help of all these modules, KOH-YOUNG KY8030 allows automated manufacturing and assembly of PCBs with unmatched accuracy and speed. It is the ideal choice for rapid prototyping and production.
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