Used KOH-YOUNG KY3020F #9124417 for sale

KOH-YOUNG KY3020F is a state-of-the-art pc board assembly and manufacturing equipment designed for cost-effective surface mount assembly and repair. This system offers automated and intelligent production processes with a flexible flow to meet various customer designs. KY3020F features a 3D AOI (Automatic Optical Inspection) which offers superior accuracy for identifying solder joint defects and inspecting components, a powerful 3D SPI (Soldering Process Inspector) for inspecting solder joint heights, an intuitive VisionPro software suite for reliable programming, as well as a convenient Data Management Console for quick and easy data collection. KOH-YOUNG KY3020F is equipped with a click-type PC board holder which offers superior stability and accuracy for holding printed circuit boards during the inspection process. The included ECA-8000 Reflow oven offers rapid, high-temperature processing to ensure optimal solder joint strength and reliability. KY3020F also includes an array of advanced safety features such as a pop-up clutch, windows lock-out capabilities, and an anti-static conductive epoxy table, all of which help to ensure the safety of personnel. KOH-YOUNG KY3020F is capable of processing a maximum 25" x 20" PC board with a maximum production speed of 120 PPH (Parts per Hour). The 3D AOI unit has a maximum resolution of 0.03906 mm for identifying component defects. The 3D SPI has a 0.5mm resolution for measuring solder joint height. KY3020F also has a static real-time process monitoring which allows for inspection data to be recorded, analyzed, and tracked for improved yield performance. In conclusion, KOH-YOUNG KY3020F is an innovative pc board assembly and manufacturing machine featuring quality processes and flexible flow for enhancing production efficiency and quality. This tool includes a 3D AOI, 3D SPI, ECA-8000 Reflow Oven, and several advanced safety features for ensuring safe operation. KY3020F is capable of processing boards up to 25" x 20" at speeds of up to 120 PPH and has a maximum resolution of 0.03906 mm for identifying solder joint defects. This asset is sure to deliver cost effective surface mount assembly and repair.