Used KOH-YOUNG SPI S8030D #9383588 for sale

KOH-YOUNG Technology KOH-YOUNG SPI S8030D is a PC Board Assembly and Manufacturing System that is designed to assist the manufacturing process of printed circuit boards. It is designed with advanced technologies to ensure accuracy and efficiency. The S8030D helps to accurately measure the solder paste, components and adhesive deposition onto the board. By doing this, it ensures that all parts are correctly placed on the board and that the solder gets applied evenly and accurately. This tool can be used to measure paste, adhesive, and conductive material deposition with impressive accuracy, as well as up to 20 different solder paste heights. The S8030D also provides automated inspection technology to ensure that each part is correctly placed and soldered. The system can scan both sides of a printed circuit board, as well as imaging components, such as SMD components and through-hole components. The inspection capabilities cover laser fiducial, solder paste, material deposition and component placement. The S8030D also features advanced automation features to streamline the manufacturing process. It can be equipped with various nozzles and fixturing, as well as multiple-frame storages and automatic feeders. This helps to reduce cycle times and improve efficiency. Furthermore, its modular design makes it easy to add, remove, and replace components, allowing for quick and easy maintenance. The S8030D is designed to be used in a variety of applications, including high-volume production environments. It is designed to be robust and reliable, and it can be used with a wide range of process equipment. Furthermore, it is CE-certified, and its open software architecture ensures compatibility with many 3rd-party systems. The S8030D is a powerful tool for any PC board assembly and manufacturing process. Its reliable performance and advanced features make it an ideal choice for high volume manufacturing environments.