Used MARANTZ / DJK U22XHML-350L #9160703 for sale

MARANTZ / DJK U22XHML-350L is a pc board assembly and manufacturing equipment designed for use in a variety of production environments. Its versatile features allow users to rapidly produce high-quality pc boards in a fraction of the time. The system is capable of performing through-hole, surface mount and mixed technology boards at a consistently high rate of speed, with adjustable soldering temperatures for optimal solder joint formation. DJK U22XHML-350L consists of several components, including a solder pot, reflow oven, pick and place machine, and a vision unit. The solder pot uses an open pot design, which allows for improved temperature control and uniformity. Its enclosed nozzle design minimizes spattering and ensures consistent surface wetting. The integrated reflow oven is designed to provide a reliable, uniform temperature profile with minimal thermal gradients across the board. The oven also features a tempering function, which helps to avoid "cold-soldering" and reduce voiding. The oven is also equipped with high-precision sensors, which ensure stable, repeatable results. The pick and place machine is capable of placing both surface mount and through-hole components with a sliding table design. The feature-rich pick and place head allows for component rotation of up to 30 degrees and variable dwell times. The machine is also capable of accurate real-time feeder monitoring with automated feeder adjustment capabilities. The machine also features a vision tool which includes high resolution cameras with advanced defect detection algorithms. This allows for improved automation of the assembly process and improved quality assurance, and can be used for a variety of applications, including fiducial recognition, component recognition, and solder joint inspection. Overall, MARANTZ U22XHML-350L is a powerful tool for producing quality pc boards in a variety of production environments. Its versatility and advanced features allow for faster, more accurate production processes and improved quality assurance. The asset is well suited for applications where high-throughput, high-precision assembly is needed.