Used MIRAE MX 200 #9257230 for sale

MIRAE MX 200 is a pc board assembly and manufacturing equipment specifically designed for SMT, BGA, and Through Hole components. It uses the latest in laser-based solder jet technology to enable full SMT automated assembly and manufacturing. It combines three essential technologies to provide a complete SMT process: SMT Pick and Place, Surface Mount Soldering, and BGA rework/repair. Utilizing advanced artificial intelligence, the system can accurately detect and place SMT components with up to 99.5% placement accuracy. MIRAE MX200 features a high-resolution vision unit that supports multiple vision inspection techniques, including Top/Bottom Inspection, AOI (Automatic Optical Inspection), and manual fiducial alignment. It is designed for process consistency and yield optimization. To ensure high-quality soldering, it features a powerful, remotely-controlled solder jet nozzle, which is capable of depositing precise amounts of solder onto the pc board surface. This machine is capable of applying solder paste and a variety of fluxes, even on difficult-to-solder components. It can also solder/desolder fine-pitched BGA components with ease. The tool also supports a wide range of specialized tools to enable process and quality control. Through advanced parameters tuning, it is capable of fine-tuning the process parameters for improved product quality. Additionally, it offers integrated test capabilities for full per-component test and results analysis. Lastly, the asset comes with an intuitive user-friendly HMI (Human Machine Interface), which simplifies the setup and operation of the model, allowing users to easily adjust the parameters for enhanced operations. Overall, MX 200 is a highly-advanced pc board assembly and manufacturing equipment designed for maximum performance and increased efficiency. It offers state-of-the-art features to ensure reliability, ease of use, and consistent quality. Its automated capabilities allow it to handle even the most complex pc board assemblies, with minimal manual operations. With its highly precise and accurate operations, this system is ideal for SMT and BGA pc board assembly and manufacturing.